Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: MLF-16
External dimensions/packaging: MLF-16
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY89875UMG
|
Microchip | 完全替代 | MLF-16 |
MICROCHIP SY89875UMG 芯片, 时钟驱动器/扇出缓冲器, LVDS, 16MLF 新
|
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