Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: HVQCCN
External dimensions/packaging: HVQCCN
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY89872UMI
|
Microchip | 功能相似 | VFQFN-16 |
2.5V, 2GHz ANY DIFF. IN-TO-LVDS PROGRAMMABLE CLOCK DIVIDER/FANOUT BUFFER WITH INTERNAL TERMINATION
|
||
SY89872UMI
|
Micrel | 功能相似 | MLF-16 |
2.5V, 2GHz ANY DIFF. IN-TO-LVDS PROGRAMMABLE CLOCK DIVIDER/FANOUT BUFFER WITH INTERNAL TERMINATION
|
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