Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: TQFP
External dimensions/length: 10 mm
External dimensions/width: 10 mm
External dimensions/packaging: TQFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY89828LHI
|
Micrel | 功能相似 | 64-EP-TQFP |
IC CLK BUFFER 2:10 1GHz 64TQFP
|
||
SY89828LHY
|
Microchip | 功能相似 | 64-EP-TQFP |
3.3 V 1 GHz 双 1:10 精密 LVDS 扇出缓冲器/转换器 带2:1输入多路复用器
|
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