Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: HVQCCN
External dimensions/packaging: HVQCCN
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY89833LMG
|
Micrel | 功能相似 | VFQFN-16 |
SY89833LMG 时钟缓冲器, 16针 MLF封装
|
||
SY89833LMG-TR
|
Microchip | 功能相似 | MLF-16 |
Clock Buffer
|
||
SY89833LMI
|
Micrel | 功能相似 | MLF |
IC CLK BUFFER 1:4 2GHz 16MLF
|
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