Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY89830UK4G
|
Microchip | 功能相似 | TSSOP-16 |
Microchip ### 时钟发生器/缓冲器
|
||
SY89830UK4G
|
Micrel | 功能相似 | TSSOP-16 |
Microchip ### 时钟发生器/缓冲器
|
||
SY89830UK4I
|
Microchip | 功能相似 | TSSOP-16 |
2.5V/3.3/5V 2.5GHz 1:4 PECL/ECL CLOCK DRIVER WITH 2:1 DIFFERENTIAL INPUT MUX
|
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