Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 32
Encapsulation parameters/Encapsulation: TQFP-32
External dimensions/packaging: TQFP-32
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY89808LTI
|
Micrel | 功能相似 | TQFP-32 |
3.3V, 500MHz, 1:9 DIFFERENTIAL HSTL (1.5V) FANOUT BUFFER/TRANSLATOR
|
||
SY89808LTI
|
Microchip | 功能相似 | TQFP-32 |
3.3V, 500MHz, 1:9 DIFFERENTIAL HSTL (1.5V) FANOUT BUFFER/TRANSLATOR
|
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