Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: HVSSON
External dimensions/packaging: HVSSON
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY89327LMGTR
|
Micrel | 功能相似 |
Translator CML/CMOS/HSTL/LVDS/SSTL/TTL to LVPECL 8Pin MLF T/R
|
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