Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: HVQCCN
External dimensions/packaging: HVQCCN
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY88973VMG
|
Micrel | 功能相似 | HVQCCN |
3.3V/5V 3.2Gbps CML LOW-POWER LIMITING POST AMPLIFIER W/TTL LOS
|
||
SY88973VMITR
|
Micrel | 功能相似 | HVQCCN |
IC AMP POST 5V/3.3V HS 16-MLF
|
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