Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: HVQCCN
External dimensions/packaging: HVQCCN
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY88952LMG
|
Microchip | 功能相似 | MLF-32 |
激光驱动器 3.3V LDD with APC
|
||
SY88952LMG
|
Micrel | 功能相似 | MLF-32 |
激光驱动器 3.3V LDD with APC
|
||
SY88952LMGTR
|
Microchip | 功能相似 | HVQCCN |
Interface Circuit, 5 X 5MM, LEAD FREE, MLF-32
|
||
SY88952LMGTR
|
Micrel | 功能相似 | HVQCCN |
Interface Circuit, 5 X 5MM, LEAD FREE, MLF-32
|
||
SY88952LMI
|
Microchip | 功能相似 | VFQFN-32 |
IC LASER DRVR 2.7Gbps 3.6V 32MLF
|
||
SY88952LMI
|
Micrel | 功能相似 | VFQFN-32 |
IC LASER DRVR 2.7Gbps 3.6V 32MLF
|
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