Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: HTSSOP
External dimensions/packaging: HTSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY88913VKG
|
Microchip | 功能相似 | MSOP-10 |
限幅放大器 3.3V-5.0V 1.25Gbps PECL Post Amp
|
||
SY88973VEY-TR
|
Microchip | 完全替代 | MSOP-10 |
限幅放大器
|
||
SY88973VEYTR
|
Micrel | 功能相似 | HTSSOP |
3.3V/5V 3.2Gbps CML LOW-POWER LIMITING POST AMPLIFIER W/TTL LOS
|
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