Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TFSOP-10
External dimensions/packaging: TFSOP-10
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY88803VKC
|
Micrel | 功能相似 | TFSOP-10 |
IC AMP POST PECL 3.3V/5V 10-MSOP
|
||
|
|
Micrel | 功能相似 | TSSOP |
3.3V/5V 155Mbps PECL LOW POWER LIMITING POST AMPLIFIER W/TTL LOS
|
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