Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TFSOP-10
External dimensions/packaging: TFSOP-10
Other/Product Lifecycle: Discontinued at Digi-Key
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: Fiber optic network
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY88903VKG-TR
|
Microchip | 功能相似 | MSOP-10 |
SY88903 系列 1 GHZ 5 V / 3.3 V 高速 限幅 后置放大器 - MSOP-10
|
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