Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TFSOP-10
External dimensions/packaging: TFSOP-10
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY88309BLEY-TR
|
Microchip | 完全替代 | MSOP-10 |
限幅放大器
|
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