Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TFSOP-10
External dimensions/packaging: TFSOP-10
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY88347DLEY
|
Microchip | 功能相似 | MSOP-10 |
3.3V 155-3200Mbps PECL Post Amp, 10 MSOP 3x3x1.0mm TUBE
|
||
SY88903ALKG
|
Microchip | 功能相似 | MSOP-10 |
3.3 V 1.25 Gbps PECL 后置放大器:4xLOS 增益/1xTC /10 MSOP//卷盘包装(工业温度 绿色)
|
||
SY88903ALKG
|
Micrel | 功能相似 | MSOP-10 |
3.3 V 1.25 Gbps PECL 后置放大器:4xLOS 增益/1xTC /10 MSOP//卷盘包装(工业温度 绿色)
|
||
SY88933ALKG
|
Microchip | 功能相似 | MSOP-10 |
SP Amp Limiting Post Amplifier Single 3.6V 10Pin MSOP
|
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