Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY88793VKC
|
Micrel | 功能相似 | TFSOP-10 |
3.3V/5V 622Mbps PECL LOW-POWER LIMITING POST AMPLIFIER WITH TTL SIGNAL DETECT
|
||
SY88793VKG
|
Microchip | 功能相似 | TFSOP-10 |
限幅放大器 3.3V/5V 622Mbps PECL Post Amplifier
|
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