Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
NXP | 功能相似 | SOIC |
ON SEMICONDUCTOR MC10EP11DG 缓冲器
|
||
MC10EP11DR2G
|
ON Semiconductor | 功能相似 | SOIC-8 |
3.3V / 5V ECL 1 : 2差分扇出缓冲器 3.3V / 5V ECL 1:2 Differential Fanout Buffer
|
||
SY10EP11UZC
|
Microchip | 类似代替 | SOIC-8 |
2.5V/3.3V/5V 1:2 DIFFERENTIAL PECL/LVPECL/ECL FANOUT BUFFER
|
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