Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
NXP | 功能相似 | SOIC |
ON SEMICONDUCTOR MC10EL89DG 芯片, ECL 100 逻辑器件
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||
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|
Motorola | 功能相似 |
ON SEMICONDUCTOR MC10EL89DG 芯片, ECL 100 逻辑器件
|
|||
MC10EL89DG
|
ON Semiconductor | 功能相似 | SOIC-8 |
ON SEMICONDUCTOR MC10EL89DG 芯片, ECL 100 逻辑器件
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|
Motorola | 功能相似 |
5V ECL同轴电缆驱动器 5V ECL Coaxial Cable Driver
|
|||
|
|
Micrel | 完全替代 | SOIC |
Clock Fanout Buffer 2Out 8Pin SOIC N
|
||
SY10EL89ZC
|
Microchip | 完全替代 | SOIC-8 |
Clock Fanout Buffer 2Out 8Pin SOIC N
|
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