Technical parameters/number of output interfaces: 4
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY10EL38LZG
|
Microchip | 完全替代 | SOIC-20 |
Clock Divider Buffer 4Out 20Pin SOIC W
|
||
SY10EL38LZG
|
Micrel | 完全替代 | SOIC-20 |
Clock Divider Buffer 4Out 20Pin SOIC W
|
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