Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-16
External dimensions/packaging: SOIC-16
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY100H641AJC
|
Microchip | 类似代替 | LCC-28 |
IC CLK BUFFER 1:9 80MHz 28PLCC
|
||
SY100H641LJZ
|
Microchip | 功能相似 | PLCC-28 |
IC CLK BUFFER 1:9 135MHz 28PLCC
|
||
SY100H641LJZ
|
Micrel | 功能相似 | PLCC-28 |
IC CLK BUFFER 1:9 135MHz 28PLCC
|
||
SY100H841LZH
|
Microchip | 类似代替 | SOIC-16 |
3.3V Quad PECL-to-TTL with Output Enable, 16 SOIC 0.3in TUBE
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review