Technical parameters/number of circuits: 1
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TFSOP-10
External dimensions/packaging: TFSOP-10
Physical parameters/operating temperature: 0℃ ~ 85℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY100ELT982KI
|
Micrel | 功能相似 | TFSOP-10 |
IC TRANSLATOR PECL-CML 10-MSOP
|
||
SY100ELT982KI
|
Microchip | 功能相似 | TFSOP-10 |
IC TRANSLATOR PECL-CML 10-MSOP
|
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