Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Motorola | 功能相似 |
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ON Semiconductor | 功能相似 | SOIC-8 |
3.3V LVTTL / LVCMOS到差分LVPECL翻译 3.3V LVTTL/LVCMOS to Differential LVPECL Translator
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