Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: QCCJ
External dimensions/packaging: QCCJ
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY100H641LJC
|
Microchip | 功能相似 | LCC-28 |
IC CLK BUFFER 1:9 135MHz 28PLCC
|
||
SY100H641LJZ
|
Microchip | 功能相似 | PLCC-28 |
SY100H641L Series 135MHz 3.3V Single Supply 1:9 PECL-To-TTL - PLCC-28
|
||
SY100H641LJZ
|
Micrel | 功能相似 | PLCC-28 |
SY100H641L Series 135MHz 3.3V Single Supply 1:9 PECL-To-TTL - PLCC-28
|
||
|
|
Micrel | 功能相似 | SOIC |
SINGLE SUPPLY QUAD PECL-TO-TTL W/LATCHED OUTPUT ENABLE
|
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