Technical parameters/operating temperature (Max): 100 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 1.14V ~ 2.625V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: LFBGA-256
External dimensions/packaging: LFBGA-256
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microsemi | 类似代替 | LFBGA-256 |
Ic Fpga 138 i/o 256vfbga
|
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