Technical parameters/RAM size: 8K x 8
Technical parameters/dissipated power: 526 mW
Technical parameters/Analog to Digital Conversion (ADC): 1
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 526 mW
Technical parameters/Digital to Analog Conversion (DAC): 1
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 32
Encapsulation parameters/Encapsulation: UFQFN-32
External dimensions/length: 5.1 mm
External dimensions/width: 5.1 mm
External dimensions/height: 0.55 mm
External dimensions/packaging: UFQFN-32
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
Customs information/ECCN code: 3A991A2
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