Technical parameters/Contact electroplating: Tin Lead
Technical parameters/direction: Vertical
Encapsulation parameters/installation method: Surface Mount
Physical parameters/contact material: Beryllium Copper
Physical parameters/shell material: Aluminum
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
Compliant with standards/ELV standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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