Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
STK11C68-C35
|
Cypress Semiconductor | 类似代替 | CDIP-28 |
64千位( 8K ×8 ) SoftStore的nvSRAM 64 Kbit (8K x 8) SoftStore nvSRAM
|
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