Encapsulation parameters/Encapsulation: LFQFP
External dimensions/packaging: LFQFP
Other/Product Lifecycle: Not Recommended for New Designs
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ST92F150CV1QB
|
ST Microelectronics | 功能相似 | LQFP-100 |
8月16日- BIT单电压闪存单片机系列内存, E3 ™(模拟EEPROM ) , CAN 2.0B和J1850 BLPD 8/16-BIT SINGLE VOLTAGE FLASH MCU FAMILY WITH RAM, E3 TM(EMULATED EEPROM), CAN 2.0B AND J1850 BLPD
|
||
ST92F150CV1TB
|
ST Microelectronics | 功能相似 | LQFP-100 |
8月16日- BIT单电压闪存单片机系列内存, E3 TMEMULATED EEPROM , CAN 2.0B和J1850 BLPD 8/16-BIT SINGLE VOLTAGE FLASH MCU FAMILY WITH RAM, E3 TMEMULATED EEPROM, CAN 2.0B AND J1850 BLPD
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review