Technical parameters/RAM size: 512 x 8
Technical parameters/dissipated power: 500 mW
Technical parameters/dissipated power (Max): 500 mW
Technical parameters/power supply voltage (Max): 5.5 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 32
Encapsulation parameters/Encapsulation: TQFP-32
External dimensions/packaging: TQFP-32
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ST72F325K4T6
|
ST Microelectronics | 完全替代 | LQFP-32 |
8位MCU 16〜 60K闪存/ ROM , ADC , CSS , 5个定时器, SPI , SCI , I2C接口 8-bit MCU with 16 to 60K Flash/ROM, ADC, CSS, 5 timers, SPI, SCI, I2C interface
|
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