Technical parameters/RAM size: 256 x 8
Technical parameters/I/O pin count: 22
Technical parameters/Analog to Digital Conversion (ADC): 1
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 500 mW
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 32
Encapsulation parameters/Encapsulation: DIP-32
External dimensions/packaging: DIP-32
Physical parameters/operating temperature: -10℃ ~ 85℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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