Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN74SSTVF16857GR
|
TI | 功能相似 | TSSOP-48 |
14位寄存缓冲器与SSTL 2可输入和输出 14 BIT REGISTERED BUFFER WITH SSTL 2 INPUT AND OUTPUTS
|
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