Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: TFBGA
External dimensions/packaging: TFBGA
Other/Product Lifecycle: Not Listed by Manufacturer
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SST38VF6402B-70I/CD
|
Microchip | 功能相似 | TFBGA-48 |
Flash Parallel 3.3V 64Mbit 4M x 16Bit 48Pin TFBGA
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review