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Description SST12LP25 2.4 GHz WLAN 802.11b/g/n/Microchip's SST12LP25 device is an efficient power amplifier (PA) designed for applications that comply with IEEE802.11.b/g/n. This PA can be easily configured for high-power applications, providing a 27 dB gain and a 35% increase in power efficiency, while meeting the requirements of a 22 dBm 802.11g spectrum mask. At 3% EVM, the linearity is typically 18.5 dBm with 54 Mbps 802.11g operation. It also has simple board level applications and high-speed power on/off control, which can be achieved through a single combination reference voltage pin. ###Features: High gain - When the temperature is between -20 ° C and+85 ° C, 2.4-2.5 GHz occurs, P1dB>24 dBm meets the requirements of 802.11g OFDM spectrum mask, up to 22 dBm. When operating at 802.11g 54 Mbps, it is usually 18.5 dBm, with 802.11n MCS7-HT40-50% load cycle, it is usually 18 dBm, with 802.11b 1 Mbps ACPR requirements, up to 22 dBm. High speed power on/off 10:1 VSWR shock resistance (unconditional stability, up to 22 dBm). Simple input/output matching for on-chip power detection. Typical applications: WLAN (IEEE 802.11b/g/n), WLAN 256 QAM AP router, WiMax (IEEE 816), cordless phone, 2.4 GHz ISM wireless device. RF (RF) amplifier, Microchip
Product QR code
Packaging VFQFN-16
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
2.3  yuan 2.3yuan
5+:
$ 3.1104
25+:
$ 2.8800
50+:
$ 2.7187
100+:
$ 2.6496
500+:
$ 2.6035
2500+:
$ 2.5459
5000+:
$ 2.5229
10000+:
$ 2.4883
Quantity
5+
25+
50+
100+
500+
Price
$3.1104
$2.8800
$2.7187
$2.6496
$2.6035
Price $ 3.1104 $ 2.8800 $ 2.7187 $ 2.6496 $ 2.6035
Start batch production 5+ 25+ 50+ 100+ 500+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(4879) Minimum order quantity(5)
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Technical parameters/frequency: 2.4GHz ~ 2.5GHz

Technical parameters/output power: 19 dBm

Technical parameters/gain: 27 dB

Technical parameters/testing frequency: 2.4 GHz

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): -40 ℃

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 16

Encapsulation parameters/Encapsulation: VFQFN-16

External dimensions/length: 3 mm

External dimensions/width: 3 mm

External dimensions/height: 0.55 mm

External dimensions/packaging: VFQFN-16

Other/Product Lifecycle: Unknown

Other/Packaging Methods: Tape & Reel (TR)

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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