Technical parameters/operating temperature (Max): 120 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SMD
External dimensions/packaging: SMD
Other/Product Lifecycle: Active
Other/Manufacturing Applications: 3G,4G,CDMA,DCS,EDGE,GPRS,GSM,HSPA,IMT,LTE,PCS,UMTS,WCDMA, 3G, 4G, CDMA, DCS, EDGE, GPRS, GSM, HSPA, IMT, LTE, PCS, UMTS, WCDMA
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
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