Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC-16
External dimensions/width: 5.59 mm
External dimensions/packaging: SOIC-16
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SOMC160322K1FEA
|
Vishay Semiconductor | 类似代替 |
Res Thick Film NET 22.1KΩ 1% 1.28W ±100ppm/℃ ISOL Molded 16Pin DIP Gull Wing SMD T/R
|
|||
SOMC16033K30JEA
|
Vishay Semiconductor | 类似代替 | SOIC-16 |
Res Thick Film NET 3.3KΩ 5% 1.28W ±100ppm/℃ ISOL Molded 16Pin DIP Gull Wing SMD T/R
|
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