Technical parameters/power supply voltage (DC): 3.00V (min)
Technical parameters/power supply current: 110 mA
Technical parameters/dissipated power: 1377 W
Technical parameters/input current (Min): 25 μA
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/dissipated power (Max): 1377 mW
Technical parameters/power supply voltage: 3V ~ 3.6V
Technical parameters/power supply voltage (Max): 3.6 V
Technical parameters/power supply voltage (Min): 3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: TSSOP-56
External dimensions/length: 14 mm
External dimensions/width: 6.1 mm
External dimensions/height: 1.15 mm
External dimensions/packaging: TSSOP-56
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Not Recommended for New Designs
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN65LVDS93ADGG
|
TI | 类似代替 | TSSOP-56 |
TEXAS INSTRUMENTS SN65LVDS93ADGG SerDes, 串行/解串器, 135 Mbps, CMOS, LVDS, TSSOP, 56 引脚
|
||
SN75LVDS83DGGR
|
TI | 完全替代 | TSSOP-56 |
FlatLink™ 发送器 56-TSSOP 0 to 70
|
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