Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HD74LS373FPEL
|
Renesas Electronics | 功能相似 | SOP |
八路D型透明锁存器(三态输出) Octal D-type Transparent Latches (with three-state outputs)
|
||
SN74LS373DWE4
|
TI | 功能相似 | SOP |
八D型透明锁存器和边沿触发触发器 OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
|
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