Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HD74LS107AP
|
Renesas Electronics | 功能相似 | DIP |
双路JK下降沿触发的触发器(带清除) Dual J-K Negative-edge-triggered Flip-Flops (with Clear)
|
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