Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN65MLVD047D
|
TI | 功能相似 | SOIC-16 |
多点LVDS四路差分线路驱动器 MULTIPOINT-LVDS QUAD DIFFERENTIAL LINE DRIVER
|
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