Technical parameters/peak pulse power: 300 W
Technical parameters/minimum reverse breakdown voltage: 4 V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/packaging: SOIC-8
Physical parameters/operating temperature: -55℃ ~ 150℃ (TJ)
Other/Product Lifecycle: Active
Other/Manufacturing Applications: General
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microchip | 完全替代 | Reel |
TVS ARRAY BIDIR 300W 3.3V 8SOIC
|
||
SMDA03C-4E3/TR13
|
Microsemi | 完全替代 | SOIC-8 |
TVS ARRAY BIDIR 300W 3.3V 8SOIC
|
||
|
|
Microchip | 完全替代 | Reel |
Diode: Transil array; 4V; 5A; 300W; SO8; Features: ESD protection
|
||
SMDB03CE3/TR7
|
Microsemi | 类似代替 | SO-8 |
TVS ARRAY BIDIR 500W 3.3V 8SOIC
|
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