Technical parameters/dissipated power: 275 mW
Technical parameters/descent time (Max): 4.6 ns
Technical parameters/rise time (Max): 6.5 ns
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 275 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Physical parameters/operating temperature: -40℃ ~ 125℃
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
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