Chip AI consultant
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: DFN
External dimensions/packaging: DFN
Other/EU RoHS: Compliant
Other/ECCN (US): EAR99
Other/Part Status: Active
Other/Standard Package Name: DFN
Other/Pin Count: 8
Other/Supplier Package: TDFN EP
Other/Counting: Surface Mount
Other/Package Height: 0.73
Other/Package Length: 1.6
Other/Package Width: 1.4
Other/PCB changed: 8
Other/Lead Shape: No Lead
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review