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Model ATPROTO1-XPRO
Description ATPROTO1-XPRO Xplained Pro ATPROTO1-XPRO XPlaid Pro expansion board is designed for prototyping small circuits. The board can be divided into three parts; **1) * * * * Prototype design area * * Two * * through holes * * and * * SMD * * components can use 200 square pads for prototype design. There are letters and numbers marked on both sides of the board, making it very easy to establish precise connections. When needed, the solderless test circuit board can be placed on top of the expansion board. **2) The top of the expansion board is disconnected, and external power can be connected to the XPlaid Pro MCU board using screw terminal blocks. **3) The bottom of the expansion board includes a right angle socket, a vertical socket, and a prototype design area. The right angle socket can be connected to any XPlaid Pro MCU board, while the vertical socket can connect the * * expansion module * * or * * expansion signal * * to the prototype design area. The beneficial feature of XPlaid Pro platform is the integration of * * Atmel Studio * *, which includes Atmel software framework drivers and demonstration code, and supports streaming data. **ATPROTO1-XPRO expansion board features and advantages * * 200 square pad prototype design area with 2.54mm spacing support XPlaid Pro expansion module solderless test circuit board capacity
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Brand: Microchip
Packaging KIT
Delivery time
Packaging method Bulk
Standard packaging quantity 1
307.77  yuan 307.77yuan
1+:
$ 353.9344
10+:
$ 344.7013
50+:
$ 337.6226
100+:
$ 335.1604
200+:
$ 333.3138
500+:
$ 330.8517
1000+:
$ 329.3128
2000+:
$ 327.7740
Quantity
1+
10+
50+
100+
200+
Price
$353.9344
$344.7013
$337.6226
$335.1604
$333.3138
Price $ 353.9344 $ 344.7013 $ 337.6226 $ 335.1604 $ 333.3138
Start batch production 1+ 10+ 50+ 100+ 200+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(8081) Minimum order quantity(1)
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Encapsulation parameters/installation method: Surface Mount

Encapsulation parameters/Encapsulation: KIT

External dimensions/packaging: KIT

Other/Product Lifecycle: Unknown

Other/Packaging Methods: Bulk

Other/Manufacturing Applications: Hobbies and Education, Hobby&Education

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: lead-free

Compliant with standards/REACH SVHC standards: No SVHC

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