Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 324
Encapsulation parameters/Encapsulation: LFBGA-324
External dimensions/packaging: LFBGA-324
Physical parameters/operating temperature: -40℃ ~ 125℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XA6SLX9-2CSG324Q
|
Xilinx | 完全替代 | LFBGA-324 |
XA6SLX9-2CSG324Q 磨码
|
||
XC6SLX9-3CSG324C
|
Xilinx | 完全替代 | LFBGA-324 |
XC6SLX9-3CSG324C 磨码
|
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