Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP-16
External dimensions/length: 5.1 mm
External dimensions/width: 4.5 mm
External dimensions/height: 0.95 mm
External dimensions/packaging: TSSOP-16
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SC18IS602BIPW,112
|
NXP | 完全替代 | TSSOP-16 |
NXP SC18IS602BIPW,112 接口桥接器, 2.4 V, 3.6 V, TSSOP, 16 引脚, -40 °C
|
||
SC18IS602BIPW,128
|
NXP | 完全替代 | TSSOP-16 |
I2C至SPI桥
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review