Technical parameters/forward voltage (Max): 900 mV
Technical parameters/forward current (Max): 1 A
Technical parameters/operating temperature (Max): 175 ℃
Technical parameters/operating temperature (Min): -65 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: PowerDI 123
External dimensions/length: 3 mm
External dimensions/width: 1.93 mm
External dimensions/height: 1 mm
External dimensions/packaging: PowerDI 123
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
GN1G
|
SynSemi | 功能相似 |
GLASS PASSIVATED JUNCTION SILICON SURFACE MOUNT
|
|||
GN1G
|
EIC | 功能相似 | DO-214AC |
GLASS PASSIVATED JUNCTION SILICON SURFACE MOUNT
|
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