Technical parameters/RAM size: 32 KB
Technical parameters/dissipated power: 1000 mW
Technical parameters/dissipated power (Max): 1000 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 144
Encapsulation parameters/Encapsulation: LQFP
External dimensions/packaging: LQFP
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
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