Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SO
External dimensions/packaging: SO
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SA5209D
|
NXP | 功能相似 | SOIC |
WIDEBAND可变增益放大器 Wideband variable gain amplifier
|
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