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Description Harwin EZ Boardware SMT RFI/The grounding spring contact EZ BodWare SMT grounding/RFI spring contact is suitable for use on surface mounted printed circuit boards in contact with metal shields or frames. The simple C-shaped design of these EZ BodWare spring contacts provides excellent spring properties and ensures positive contact with the mating surface. These EZ BondWare RFI/ground contacts are suitable for wiping and sliding operations, and are ideal for automation requirements using standard mounting equipment. Inventory numbers 788-4852 and 788-4858 are multi-directional spring contacts with unique spring characteristics that can be used in both vertical and horizontal directions. This feature makes it particularly suitable for edge connections on printed circuit boards to the bottom. ###The characteristics and advantages are particularly suitable for surface mounted printed circuit boards. The excellent spring properties are designed for automated applications using standard mounting equipment, suitable for wiping and sliding applications. Multi directional models are available for edge connections of printed circuit boards, providing multiple working heights. The compact size of these EZ BondWare grounding spring contacts makes them particularly suitable for applications in restricted and blind insertion areas. Typical applications include location tracking, home entertainment and instrument panels, industrial process control equipment, mobile power units, mobile control devices, and printed circuit board accessories
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Brand: Harwin
Packaging -
Delivery time
Packaging method
Standard packaging quantity 1
1.37  yuan 1.37yuan
5+:
$ 1.8536
25+:
$ 1.7163
50+:
$ 1.6201
100+:
$ 1.5790
500+:
$ 1.5515
2500+:
$ 1.5172
5000+:
$ 1.5034
10000+:
$ 1.4828
Quantity
5+
25+
50+
100+
500+
Price
$1.8536
$1.7163
$1.6201
$1.5790
$1.5515
Price $ 1.8536 $ 1.7163 $ 1.6201 $ 1.5790 $ 1.5515
Start batch production 5+ 25+ 50+ 100+ 500+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(4525) Minimum order quantity(5)
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Technical parameters/rated current: 4 A

Encapsulation parameters/Encapsulation: -

External dimensions/length: 6.95 mm

External dimensions/width: 2.5 mm

External dimensions/height: 5.57 mm

External dimensions/packaging: -

Physical parameters/materials: Copper Alloy

Physical parameters/operating temperature: -55℃ ~ 125℃

Other/Product Lifecycle: Active

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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