Technical parameters/power supply current: 170 mA
Technical parameters/digits: 32
Technical parameters/access time: 5.4 ns
Technical parameters/access time (Max): 7ns, 5.4ns
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 2.3V ~ 2.7V
Technical parameters/power supply voltage (Max): 2.7 V
Technical parameters/power supply voltage (Min): 2.3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 90
Encapsulation parameters/Encapsulation: BGA-90
External dimensions/packaging: BGA-90
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Discontinued at Digi-Key
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: PB free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IS42RM32160E-75BL
|
Integrated Silicon Solution | 功能相似 | TFBGA-90 |
DRAM Chip Mobile SDRAM 512Mbit 16Mx32 3.3V 90Pin TFBGA
|
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