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Description Fast recovery rectifier 1.4A to 20A, Vishay Semiconductor uses industrial standard packaging types of multi-purpose, efficient and fast recovery power diodes. ###Diodes and rectifiers, Vishay Semiconductor
Product QR code
Brand: VISHAY
Packaging DO-214AB-2
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
4.04  yuan 4.04yuan
5+:
$ 5.4554
25+:
$ 5.0513
50+:
$ 4.7684
100+:
$ 4.6472
500+:
$ 4.5663
2500+:
$ 4.4653
5000+:
$ 4.4249
10000+:
$ 4.3643
Quantity
5+
25+
50+
100+
500+
Price
$5.4554
$5.0513
$4.7684
$4.6472
$4.5663
Price $ 5.4554 $ 5.0513 $ 4.7684 $ 4.6472 $ 4.5663
Start batch production 5+ 25+ 50+ 100+ 500+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(5607) Minimum order quantity(5)
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Technical parameters/number of pins: 2

Technical parameters/forward voltage: 1.3 V

Technical parameters/thermal resistance: 15℃/W (RθJL)

Technical parameters/reverse recovery time: 250 ns

Technical parameters/Maximum reverse voltage (Vrrm): 600 V

Technical parameters/forward current: 3 A

Technical parameters/Maximum forward surge current (Ifsm): 100 A

Technical parameters/maximum reverse leakage current (Ir): 10 uA

Technical parameters/forward voltage (Max): 1.3 V

Technical parameters/forward current (Max): 3 A

Technical parameters/operating temperature (Max): 150 ℃

Technical parameters/operating temperature (Min): -55 ℃

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 2

Encapsulation parameters/Encapsulation: DO-214AB-2

External dimensions/length: 7.11 mm

External dimensions/width: 6.22 mm

External dimensions/height: 2.42 mm

External dimensions/packaging: DO-214AB-2

Other/Product Lifecycle: Active

Other/Packaging Methods: Tape & Reel (TR)

Other/Minimum Packaging: 850

Other/Manufacturing Applications: Communication and networking, power management, consumer electronics, industrial, automotive

Compliant with standards/RoHS standards:

Compliant with standards/lead standards: Lead Free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
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